当前“
预售MCU
”共 1989件相关商品封装/规格
- -
- 2.5x3.2mm
- 3.2x5mm
- 5x7mm
- BGA-100
- BGA-144
- BGA-169
- DFN-10
- DFN-10(3x3)
- DFN-4
- DFN-4(2.5x3.2)
- DFN-6
- DFN-6(2.5x3.2)
- DFN-6(5x7)
- DFN-8
- DFN-8(2x3)
- DFN-8(3.3x3.3)
- DFN-8(5x6)
- DIP-18
- DIP-28
- DIP-32
- DIP-8
- LGA-124(9x9)
- LGA-4
- LGA-6
- LQFP-128(14x20)
- LQFP-32(7x7)
- LQFP-44
- LQFP-44(10x10)
- LQFP-48(7x7)
- LQFP-64(10x10)
- LQFP-64(14x14)
- LQFP-80
- M2-J-8
- M2-P-8
- MSOP-8
- QFN-100-EP(12x12)
- QFN-16
- QFN-16(2.5x2.5)
- QFN-16-EP(3x3)
- QFN-20-EP(5x5)
- QFN-24-EP(4x4)
- QFN-28
- QFN-28-EP(4x4)
- QFN-28-EP(6x6)
- QFN-32
- QFN-32(5x5)
- QFN-32-EP(4x4)
- QFN-44-EP(8x8)
- QFN-48
- QFN-6
- QFN-64
- QFN-64-EP(9x9)
- QFN-72-EP(10x10)
- SMD-36P
- SMD-4P,2.5x2mm
- SMD3225-4P
- SOP-14
- SOP-16-300mil
- SOP-18
- SOP-18-300mil
- SOP-20-300mil
- SOP-28
- SOP-28-300mil
- SOP-8
- SOT-223
- SOT-23-5
- SSOP-16-150mil
- SSOP-20
- SSOP-24-150mil
- SSOP-28
- TSOP-40-10.0mm
- TSSOP-8
品牌
- MICROCHIP(美国微芯)
- NXP(恩智浦)
- ST(意法半导体)
包装/方式
- 托盘
- 管装
- 编带
- 袋装
筛选结果：
1989
